TeraSi secures 13 MSEK funding to build next-gen wireless components and packaging
TeraSi, a Stockholm based tech-startup, has successfully raised 13 MSEK in a pre-seed funding round to accelerate the development of their revolutionary system-in-package technology. This breakthrough innovation addresses the crucial challenge of efficiently packaging high-frequency chips, enabling the realization of the next generation of wireless.
6G will push us to higher frequencies than ever, bringing massive data rates, unprecedented spatial resolution, and a host of new applications to life. For the first time, we will exploit frequencies as high as 200 GHz – almost ten times higher than mm-wave systems – at scale. But before it's possible to realize society's visions of next-gen wireless, there needs to be hardware to support it. Decades of academic research have given the Sting company TeraSi chips that can operate at such high frequencies.
– Our technology offers the best combination of performance, compactness, and volume scalability. It solves the packaging and integration bottleneck above 60 GHz. We're excited to start scaling our technology and show its true potential over the coming years, says James Campion, CEO of TeraSi.
The 15 MSEK funding comes from leading venture capital firms Navigare Ventures, Almi Invest, Onsight Ventures, and Deeptech Labs, as well as follow-on investments from all existing investors.
Quotes from investors:
Alex Basu, Investment Manager, Navigare Ventures:
"TeraSi has demonstrated an exceptional ability to engineer new RF-solutions that we think will be key to the deployment of next generation wireless technologies like 6G. We look forward to supporting the team as they continue the long tradition of RF-technology development in Sweden."
Gustav Notander, Investment Manager, Almi Invest:
"TeraSi has a great team and a truly unique technology platform that is on a path to becoming a key enabling technology for the coming 6G communication network. In TeraSi, we see both a very large business potential and the potential to create new and improved services that provide societal impact, so we are very excited about this investment and we look forward to supporting TeraSi on their journey towards realizing that potential."
Miles Kirby, CEO, Deeptech Labs:
"Since participating in Deeptech Labs’ Spring ‘23 cohort, TeraSi has gone from strength to strength and this marks another key milestone in its journey. We are thrilled to support this latest funding round and look forward to working with the TeraSi team as they continue to scale their technology. Further enhancing their mission in solving high frequency packaging issues and enabling a new frontier of exciting applications."
Next step for TeraSi
TeraSi’s first step is to expand their engineering team to meet customer demand. The funding will also allow the team to invest in new manufacturing infrastructure and pursue an aggressive IP strategy. Commercial launch of new products for the test and measurement, radar and wireless markets will follow.